Photonic Gyroscope
Our photonic gyroscopes utilize the optical properties of light in an integrated circuit to detect rotation accurately and reliably.
- Single photonic integrated circuit (PIC)
- No moving parts
- No need for vacuum packaging
Products: Sensing motion with light
Our patented technology exploits the physics of light - the Sagnac effect - to detect motion with exceptional accuracy and reliability in one small and light chip.
We design and manufacture unique motion sensors
Inertial Measurement Unit (IMU)
Our IMUs combine our patented photonic gyroscopes with integrated MEMS accelerometers to accurately track 6 axes of motion.
- Single integrated unit
- 3 rotational and 3 translational axes
- Remarkable advantages over alternatives
General specifications
- Size: 7cm x 6cm x 6cm
- Power: 1.2 Watts
- Weight < 310 g
- < 0.5°/hr Gyro Bias Instability
- < 0.05°/√hr Angular Random Walk
- < 0.3% SF Error
- < 0.03 m/s/√hr Accelerometer VRW
- RS-422 and auxiliary UART
- < 5µg Accel Bias Instability
- Calibrated Operation from -40 °C to +85 °C
- Patented Chip Technology
- IP67 Rating
Benefits
Mission-critical accuracy
Ultra-low bias drift makes our sensors suitable for applications where accuracy is critical.
- Ultra-low drift, even under vibration
- Ultra-low signal noise
- Gyroscope is not affected by acceleration
Reliable in harsh conditions
Exceptional performance, even in challenging circumstances.
- Light based sensing – immune to electromagnetic interference (EMI)
- Insensitive to temperature variations
- Resilient to effects of charging
- Humidity and underwater use
- Not impeded by dusty environments
- No moving parts, physically robust
Small, light and low power
Lower volume and mass compared to electronic sensors - and just one-third of the power consumption.
OSCP's sensors add minimal size, weight and power requirements.
Low cost and scalable
Our technology is suitable and ready for mass manufacturing with high speed and low unit costs.
CMOS compatible technology is scalable: ready for mass production and low cost at volume. Fully integrated chip assembly eliminates need for manual assembly, driving down costs.
The OSCP advantage
| Feature | OSCP | MEMS | FOG | RLG |
|---|---|---|---|---|
| Compact | Yes | Yes | No | No |
| Lightweight | Yes | Yes | No | No |
| Low Power | Yes | Yes | No | No |
| Low Bias Drift | Yes | No | Yes | Yes |
| Vibration Resilient | Yes | No | Yes | Yes |
| High Bandwidth | Yes | No | Yes | Yes |
| Temperature Resilient | Yes | No | Yes | Yes |
| CMOS Compatible | Yes | Yes | No | No |
| Scalable | Yes | Yes | No | No |
| Low Price | Yes | Yes | No | No |
Where do you need to go? Get in touch to discuss your application and how we could partner to deliver your goals. Partner with us